Автор: Peter Ramm
Название: Handbook of Wafer Bonding
Категория: Наука, Образование/Техническая литература
Издательство: John Wiley & Sons Limited
ISBN: John Wiley & Sons Limited
Тип: book
Описание: The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and e
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